AD7606 · 2 physical EMG inputs

Project lead: Muttakin Rahman · Guided build · Sources and licences

Engineering prototype. Physical tests remain required. Each row below is an assembly instruction, not a passed test.

Current breadboard handoff: Applied simulation findings · Short lab sequence · Blank bench checklist · Exact probe contacts · Current lab kit. Use v1.12 laboratory profiles. See current integrated results, digital timing and saved-data interpretation for evidence and limits. Every physical measurement remains unperformed; simulation results do not fill lab result cells.

Recording shutdown, recovery and stop indications

BB0 — Midpoint reference

Stage	Part / wire	Holes	Instruction
1	R40 · 10k	a2, a4	Insert R40: pin 1 → a2 (3V0A), pin 2 → a4 (VMID_DIV). Resistor: non-polarized; bend leads to the specified holes.
1	R41 · 10k	b4, a6	Insert R41: pin 1 → b4 (VMID_DIV), pin 2 → a6 (GND). Resistor: non-polarized; bend leads to the specified holes.
1	C30 · 1uF	c4, b6	Insert C30: pin 1 → c4 (VMID_DIV), pin 2 → b6 (GND). Use a non-polarized capacitor of the specified value. Body/lead spacing must be checked against the actual purchased part.
1	R42 · 100	a18, a20	Insert R42: pin 1 → a18 (VMID_BUF), pin 2 → a20 (VMID). Resistor: non-polarized; bend leads to the specified holes.
1	C31 · 1uF	b20, a24	Insert C31: pin 1 → b20 (VMID), pin 2 → a24 (GND). Use a non-polarized capacitor of the specified value. Body/lead spacing must be checked against the actual purchased part.
1	UB0 · MCP6002-I/P midpoint; half B grounded follower	e10, e11, e12, e13, f13, f12, f11, f10	Insert UB0: pin 1 → e10 (VMID_BUF), pin 2 → e11 (VMID_BUF), pin 3 → e12 (VMID_DIV), pin 4 → e13 (GND), pin 5 → f13 (GND), pin 6 → f12 (MID_UNUSED), pin 7 → f11 (MID_UNUSED), pin 8 → f10 (3V0A). MCP6002 DIP-8: notch toward row 9; pin 1=e10, pins 1–4 down the left, pins 5–8 up the right. Do not rotate 180°.
1	CB0 · 100nF	j10, j8	Insert CB0: pin 1 → j10 (3V0A), pin 2 → j8 (GND). 100 nF non-polarized bypass; fit close to IC supply connections.
1	Jumper · 3V0A	b2, g10	b2 → g10. Both jumper ends must occupy these exact holes.
1	Jumper · VMID_DIV	d4, a12	d4 → a12. Both jumper ends must occupy these exact holes.
1	Jumper · GND	c6, b24	c6 → b24. Both jumper ends must occupy these exact holes.
1	Jumper · GND	c24, a13	c24 → a13. Both jumper ends must occupy these exact holes.
1	Jumper · GND	b13, g13	b13 → g13. Both jumper ends must occupy these exact holes.
1	Jumper · GND	h13, f8	h13 → f8. Both jumper ends must occupy these exact holes.
1	Jumper · VMID_BUF	b18, a10	b18 → a10. Both jumper ends must occupy these exact holes.
1	Jumper · VMID_BUF	b10, a11	b10 → a11. Both jumper ends must occupy these exact holes.
1	Jumper · MID_UNUSED	g12, g11	g12 → g11. Both jumper ends must occupy these exact holes.
1	GND · wire-021	e6	Connect BB0:e6 to DIST1:b2. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V0A · wire-099	d2	Connect BB0:d2 to DIST1:b26. One lead per listed hole/contact. Verify unpowered continuity before applying power.

BB1 — EMG1 signal conditioning

Stage	Part / wire	Holes	Instruction
4	R100 · 3.3k	a2, a4	Insert R100: pin 1 → a2 (RAW0), pin 2 → a4 (RC0A). Resistor: non-polarized; bend leads to the specified holes.
4	R101 · 1M	c2, c8	Insert R101: pin 1 → c2 (RAW0), pin 2 → c8 (VMID). Resistor: non-polarized; bend leads to the specified holes.
4	C100 · 47nF	b4, b6	Insert C100: pin 1 → b4 (RC0A), pin 2 → b6 (GND). Use a non-polarized capacitor of the specified value. Body/lead spacing must be checked against the actual purchased part.
4	R102 · 3.3k	a18, a20	Insert R102: pin 1 → a18 (BUF0A), pin 2 → a20 (RC0B). Resistor: non-polarized; bend leads to the specified holes.
4	C101 · 47nF	b20, b24	Insert C101: pin 1 → b20 (RC0B), pin 2 → b24 (GND). Use a non-polarized capacitor of the specified value. Body/lead spacing must be checked against the actual purchased part.
4	R104 · 100	a26, a28	Insert R104: pin 1 → a26 (BUF0B), pin 2 → a28 (AIN0P). Resistor: non-polarized; bend leads to the specified holes.
4	C102 · 1nF	b28, b32	Insert C102: pin 1 → b28 (AIN0P), pin 2 → b32 (GND). Use a non-polarized capacitor of the specified value. Body/lead spacing must be checked against the actual purchased part.
4	UB1 · MCP6002-I/P DIP8; same amplifier family as PCB MCP6004	e10, e11, e12, e13, f13, f12, f11, f10	Insert UB1: pin 1 → e10 (BUF0A), pin 2 → e11 (BUF0A), pin 3 → e12 (RC0A), pin 4 → e13 (GND), pin 5 → f13 (RC0B), pin 6 → f12 (BUF0B), pin 7 → f11 (BUF0B), pin 8 → f10 (3V0A). MCP6002 DIP-8: notch toward row 9; pin 1=e10, pins 1–4 down the left, pins 5–8 up the right. Do not rotate 180°.
4	CB1 · 100nF local bypass	j10, j8	Insert CB1: pin 1 → j10 (3V0A), pin 2 → j8 (GND). 100 nF non-polarized bypass; fit close to IC supply connections.
4	Jumper · RC0A	c4, a12	c4 → a12. Both jumper ends must occupy these exact holes.
4	Jumper · GND	a6, a24	a6 → a24. Both jumper ends must occupy these exact holes.
4	Jumper · GND	c24, a32	c24 → a32. Both jumper ends must occupy these exact holes.
4	Jumper · GND	c32, a13	c32 → a13. Both jumper ends must occupy these exact holes.
4	Jumper · GND	b13, f8	b13 → f8. Both jumper ends must occupy these exact holes.
4	Jumper · BUF0A	b18, a10	b18 → a10. Both jumper ends must occupy these exact holes.
4	Jumper · BUF0A	b10, a11	b10 → a11. Both jumper ends must occupy these exact holes.
4	Jumper · RC0B	c20, g13	c20 → g13. Both jumper ends must occupy these exact holes.
4	Jumper · BUF0B	b26, g12	b26 → g12. Both jumper ends must occupy these exact holes.
4	Jumper · BUF0B	h12, g11	h12 → g11. Both jumper ends must occupy these exact holes.
4	GND · wire-022	d6	Connect BB1:d6 to DIST1:c2. One lead per listed hole/contact. Verify unpowered continuity before applying power.
4	3V0A · wire-100	h10	Connect BB1:h10 to DIST1:c26. One lead per listed hole/contact. Verify unpowered continuity before applying power.
4	AIN0P · wire-117	c28	Connect BB1:c28 to DIST1:a30. One lead per listed hole/contact. Verify unpowered continuity before applying power.
10	RAW0 · wire-119	b2	Connect BB1:b2 to DIST1:a31. One lead per listed hole/contact. Verify unpowered continuity before applying power.
4	RC0A · wire-121	d4	Connect BB1:d4 to DIST1:a32. One lead per listed hole/contact. Verify unpowered continuity before applying power.

BB2 — EMG2 signal conditioning

Stage	Part / wire	Holes	Instruction
5	R110 · 3.3k	a2, a4	Insert R110: pin 1 → a2 (RAW1), pin 2 → a4 (RC1A). Resistor: non-polarized; bend leads to the specified holes.
5	R111 · 1M	c2, c8	Insert R111: pin 1 → c2 (RAW1), pin 2 → c8 (VMID). Resistor: non-polarized; bend leads to the specified holes.
5	C110 · 47nF	b4, b6	Insert C110: pin 1 → b4 (RC1A), pin 2 → b6 (GND). Use a non-polarized capacitor of the specified value. Body/lead spacing must be checked against the actual purchased part.
5	R112 · 3.3k	a18, a20	Insert R112: pin 1 → a18 (BUF1A), pin 2 → a20 (RC1B). Resistor: non-polarized; bend leads to the specified holes.
5	C111 · 47nF	b20, b24	Insert C111: pin 1 → b20 (RC1B), pin 2 → b24 (GND). Use a non-polarized capacitor of the specified value. Body/lead spacing must be checked against the actual purchased part.
5	R114 · 100	a26, a28	Insert R114: pin 1 → a26 (BUF1B), pin 2 → a28 (AIN1P). Resistor: non-polarized; bend leads to the specified holes.
5	C112 · 1nF	b28, b32	Insert C112: pin 1 → b28 (AIN1P), pin 2 → b32 (GND). Use a non-polarized capacitor of the specified value. Body/lead spacing must be checked against the actual purchased part.
5	UB2 · MCP6002-I/P DIP8; same amplifier family as PCB MCP6004	e10, e11, e12, e13, f13, f12, f11, f10	Insert UB2: pin 1 → e10 (BUF1A), pin 2 → e11 (BUF1A), pin 3 → e12 (RC1A), pin 4 → e13 (GND), pin 5 → f13 (RC1B), pin 6 → f12 (BUF1B), pin 7 → f11 (BUF1B), pin 8 → f10 (3V0A). MCP6002 DIP-8: notch toward row 9; pin 1=e10, pins 1–4 down the left, pins 5–8 up the right. Do not rotate 180°.
5	CB2 · 100nF local bypass	j10, j8	Insert CB2: pin 1 → j10 (3V0A), pin 2 → j8 (GND). 100 nF non-polarized bypass; fit close to IC supply connections.
5	Jumper · RC1A	c4, a12	c4 → a12. Both jumper ends must occupy these exact holes.
5	Jumper · GND	a6, a24	a6 → a24. Both jumper ends must occupy these exact holes.
5	Jumper · GND	c24, a32	c24 → a32. Both jumper ends must occupy these exact holes.
5	Jumper · GND	c32, a13	c32 → a13. Both jumper ends must occupy these exact holes.
5	Jumper · GND	b13, f8	b13 → f8. Both jumper ends must occupy these exact holes.
5	Jumper · BUF1A	b18, a10	b18 → a10. Both jumper ends must occupy these exact holes.
5	Jumper · BUF1A	b10, a11	b10 → a11. Both jumper ends must occupy these exact holes.
5	Jumper · RC1B	c20, g13	c20 → g13. Both jumper ends must occupy these exact holes.
5	Jumper · BUF1B	b26, g12	b26 → g12. Both jumper ends must occupy these exact holes.
5	Jumper · BUF1B	h12, g11	h12 → g11. Both jumper ends must occupy these exact holes.
5	GND · wire-023	d6	Connect BB2:d6 to DIST1:d2. One lead per listed hole/contact. Verify unpowered continuity before applying power.
5	3V0A · wire-101	h10	Connect BB2:h10 to DIST1:d26. One lead per listed hole/contact. Verify unpowered continuity before applying power.
5	AIN1P · wire-123	c28	Connect BB2:c28 to DIST1:a33. One lead per listed hole/contact. Verify unpowered continuity before applying power.
10	RAW1 · wire-125	b2	Connect BB2:b2 to DIST1:a34. One lead per listed hole/contact. Verify unpowered continuity before applying power.
5	RC1A · wire-127	d4	Connect BB2:d4 to DIST1:a35. One lead per listed hole/contact. Verify unpowered continuity before applying power.

AUX1 — Controls and bias components

Stage	Part / wire	Holes	Instruction
3	10k ADC CS pull-up	e3, f3	1 → AUX1:e3; 2 → AUX1:f3 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
6	10k CS pull-up	e7, f7	1 → AUX1:e7; 2 → AUX1:f7 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
6	10k CS pull-up	e11, f11	1 → AUX1:e11; 2 → AUX1:f11 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	10k button pull-up	e15, f15	1 → AUX1:e15; 2 → AUX1:f15 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	1k LED resistor	e19, f19	1 → AUX1:e19; 2 → AUX1:f19 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	green status LED	e23, f23	ANODE → AUX1:e23; CATHODE → AUX1:f23 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	1k LED resistor	e27, f27	1 → AUX1:e27; 2 → AUX1:f27 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	red status LED	e31, f31	ANODE → AUX1:e31; CATHODE → AUX1:f31 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	1k LED resistor	e35, f35	1 → AUX1:e35; 2 → AUX1:f35 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	amber status LED	e39, f39	ANODE → AUX1:e39; CATHODE → AUX1:f39 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	100k battery divider top	e43, f43	1 → AUX1:e43; 2 → AUX1:f43 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	100k battery divider bottom	e47, f47	1 → AUX1:e47; 2 → AUX1:f47 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	100nF battery sense	e51, f51	1 → AUX1:e51; 2 → AUX1:f51 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	100k VBUS resistor	e55, f55	1 → AUX1:e55; 2 → AUX1:f55 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	GND · wire-024	g23	Connect AUX1:g23 to DIST1:e2. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-025	g31	Connect AUX1:g31 to DIST1:c3. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-026	g39	Connect AUX1:g39 to DIST1:d3. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-027	g47	Connect AUX1:g47 to DIST1:e3. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-028	g51	Connect AUX1:g51 to DIST1:c4. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	VBAT · wire-076	a43	Connect AUX1:a43 to DIST1:a20. One lead per listed hole/contact. Verify unpowered continuity before applying power.
3	3V3D · wire-086	a3	Connect AUX1:a3 to DIST1:b22. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	3V3D · wire-087	a7	Connect AUX1:a7 to DIST1:c22. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	3V3D · wire-088	a11	Connect AUX1:a11 to DIST1:d22. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	3V3D · wire-089	a15	Connect AUX1:a15 to DIST1:e22. One lead per listed hole/contact. Verify unpowered continuity before applying power.
3	ADC_CS · wire-107	g3	Connect AUX1:g3 to DIST1:a28. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	FOOT_CS · wire-138	g7	Connect AUX1:g7 to DIST1:a39. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	SHANK_CS · wire-142	g11	Connect AUX1:g11 to DIST1:a40. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BUTTON · wire-146	g15	Connect AUX1:g15 to DIST1:a41. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_REC · wire-149	a19	Connect AUX1:a19 to DIST1:a42. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_REC_A · wire-151	g19	Connect AUX1:g19 to DIST1:a43. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_REC_A · wire-152	a23	Connect AUX1:a23 to DIST1:b43. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_ERR · wire-153	a27	Connect AUX1:a27 to DIST1:a44. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_ERR_A · wire-155	g27	Connect AUX1:g27 to DIST1:a45. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_ERR_A · wire-156	a31	Connect AUX1:a31 to DIST1:b45. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_LOW · wire-157	a35	Connect AUX1:a35 to DIST1:a46. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_LOW_A · wire-159	g35	Connect AUX1:g35 to DIST1:a47. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_LOW_A · wire-160	a39	Connect AUX1:a39 to DIST1:b47. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BAT_SENSE · wire-161	g43	Connect AUX1:g43 to DIST1:a48. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BAT_SENSE · wire-162	a47	Connect AUX1:a47 to DIST1:b48. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BAT_SENSE · wire-163	a51	Connect AUX1:a51 to DIST1:c48. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	USB_VBUS · wire-165	a55	Connect AUX1:a55 to DIST1:a49. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	USB_GATE · wire-167	g55	Connect AUX1:g55 to DIST1:a50. One lead per listed hole/contact. Verify unpowered continuity before applying power.

AUX2 — Controls and bias components

Stage	Part / wire	Holes	Instruction
2	1M gate pull-down	e3, f3	1 → AUX2:e3; 2 → AUX2:f3 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	10k USB sense pull-up	e7, f7	1 → AUX2:e7; 2 → AUX2:f7 Axial resistor/nonpolar capacitor, or LED anode at e and cathode at f. Bend insulated leads to 7.62 mm span; do not force leads.
2	GND · wire-029	g3	Connect AUX2:g3 to DIST1:d4. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	3V3D · wire-090	a7	Connect AUX2:a7 to DIST1:c23. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	USB_GATE · wire-168	a3	Connect AUX2:a3 to DIST1:b50. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	USB_PRESENT_N · wire-170	g7	Connect AUX2:g7 to DIST1:a51. One lead per listed hole/contact. Verify unpowered continuity before applying power.

DIST1 — Signal and power distribution

Stage	Part / wire	Holes	Instruction
9	SOURCE_POS · wire-001	a1	Connect battery:JST-PH red + lead to DIST1:a1. Connect lab source OR battery, never both; remove both lab leads before battery attachment.
1	SOURCE_POS · wire-002	b1	Connect power-switch:SPST solder lug 1 to DIST1:b1. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	SOURCE_POS · wire-003	c1	Connect lab-supply:Red + binding post to DIST1:c1. Connect lab source OR battery, never both; remove both lab leads before battery attachment.
1	GND · wire-004	a2	Connect DIST1:a2 to DIST1:a3. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-004	a3	Connect DIST1:a2 to DIST1:a3. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-005	b3	Connect DIST1:b3 to DIST1:a4. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-005	a4	Connect DIST1:b3 to DIST1:a4. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-006	b4	Connect DIST1:b4 to DIST1:a5. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-006	a5	Connect DIST1:b4 to DIST1:a5. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-007	b5	Connect DIST1:b5 to DIST1:a6. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-007	a6	Connect DIST1:b5 to DIST1:a6. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-008	b6	Connect DIST1:b6 to DIST1:a7. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-008	a7	Connect DIST1:b6 to DIST1:a7. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-009	b7	Connect DIST1:b7 to DIST1:a8. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-009	a8	Connect DIST1:b7 to DIST1:a8. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-010	b8	Connect DIST1:b8 to DIST1:a9. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-010	a9	Connect DIST1:b8 to DIST1:a9. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-011	b9	Connect DIST1:b9 to DIST1:a10. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-011	a10	Connect DIST1:b9 to DIST1:a10. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-012	b10	Connect DIST1:b10 to DIST1:a11. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-012	a11	Connect DIST1:b10 to DIST1:a11. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-013	b11	Connect DIST1:b11 to DIST1:a12. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-013	a12	Connect DIST1:b11 to DIST1:a12. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-014	b12	Connect DIST1:b12 to DIST1:a13. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-014	a13	Connect DIST1:b12 to DIST1:a13. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-015	b13	Connect DIST1:b13 to DIST1:a14. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-015	a14	Connect DIST1:b13 to DIST1:a14. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-016	b14	Connect DIST1:b14 to DIST1:a15. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-016	a15	Connect DIST1:b14 to DIST1:a15. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-017	b15	Connect DIST1:b15 to DIST1:a16. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-017	a16	Connect DIST1:b15 to DIST1:a16. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-018	b16	Connect DIST1:b16 to DIST1:a17. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-018	a17	Connect DIST1:b16 to DIST1:a17. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-019	b17	Connect DIST1:b17 to DIST1:a18. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-019	a18	Connect DIST1:b17 to DIST1:a18. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-020	b18	Connect DIST1:b18 to DIST1:a19. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-020	a19	Connect DIST1:b18 to DIST1:a19. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-021	b2	Connect BB0:e6 to DIST1:b2. One lead per listed hole/contact. Verify unpowered continuity before applying power.
4	GND · wire-022	c2	Connect BB1:d6 to DIST1:c2. One lead per listed hole/contact. Verify unpowered continuity before applying power.
5	GND · wire-023	d2	Connect BB2:d6 to DIST1:d2. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-024	e2	Connect AUX1:g23 to DIST1:e2. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-025	c3	Connect AUX1:g31 to DIST1:c3. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-026	d3	Connect AUX1:g39 to DIST1:d3. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-027	e3	Connect AUX1:g47 to DIST1:e3. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-028	c4	Connect AUX1:g51 to DIST1:c4. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-029	d4	Connect AUX2:g3 to DIST1:d4. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-030	e4	Connect lab-supply:Black COM binding post to DIST1:e4. Connect lab source OR battery, never both; remove both lab leads before battery attachment.
1	GND · wire-031	c5	Connect reg3:GND / 5-pin row 3 to DIST1:c5. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-032	d5	Connect reg5:GND / 5-pin row 3 to DIST1:d5. One lead per listed hole/contact. Verify unpowered continuity before applying power.
9	GND · wire-033	e5	Connect battery:JST-PH black − lead to DIST1:e5. Connect lab source OR battery, never both; remove both lab leads before battery attachment.
2	GND · wire-034	c6	Connect esp:J1.22 / GND to DIST1:c6. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	GND · wire-035	d6	Connect ldo:GND pin2 → JP2.2 to DIST1:d6. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
3	GND · wire-036	e6	Connect adc:GND / CN1 photo label to DIST1:e6. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-037	c7	Connect adc:OS0 / CN1 photo label to DIST1:c7. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-038	d7	Connect adc:OS1 / CN1 photo label to DIST1:d7. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-039	e7	Connect adc:OS2 / CN1 photo label to DIST1:e7. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-040	c8	Connect adc:RAGE / CN1 photo label to DIST1:c8. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-041	d8	Connect adc:DB15 / CN1 photo label to DIST1:d8. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-042	e8	Connect adc:V3 unused input / CN2 photo label to DIST1:e8. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-043	c9	Connect adc:V4 unused input / CN2 photo label to DIST1:c9. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-044	d9	Connect adc:V5 unused input / CN2 photo label to DIST1:d9. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-045	e9	Connect adc:V6 unused input / CN2 photo label to DIST1:e9. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-046	c10	Connect adc:V7 unused input / CN2 photo label to DIST1:c10. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-047	d10	Connect adc:V8 unused input / CN2 photo label to DIST1:d10. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-048	e10	Connect adc:G beside V1 / CN2 photo label to DIST1:e10. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
10	GND · wire-049	c11	Connect myo1:GND solder pad to DIST1:c11. Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
4	GND · wire-050	d11	Connect clamp1:CHIP_PAD_1 → JP1.2 to DIST1:d11. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
3	GND · wire-051	e11	Connect adc:G beside V2 / CN2 photo label to DIST1:e11. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
10	GND · wire-052	c12	Connect myo2:GND solder pad to DIST1:c12. Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
5	GND · wire-053	d12	Connect clamp2:CHIP_PAD_1 → JP1.2 to DIST1:d12. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
6	GND · wire-054	e12	Connect foot:mikroBUS 8 / GND to DIST1:e12. Complete IMU supply, interface and configuration checks before connecting.
6	GND · wire-055	c13	Connect shank:mikroBUS 8 / GND to DIST1:c13. Complete IMU supply, interface and configuration checks before connecting.
2	GND · wire-056	d13	Connect button:NO contact 2 to DIST1:d13. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	GND · wire-057	e13	Connect usb:JP2.1 / GND to DIST1:e13. External USB inlet only; both DevKit USB sockets empty. VBUS is sense-only, never connected to recorder 5 V.
2	GND · wire-058	c14	Connect usb-q:SOURCE pin2 → JP1.3 to DIST1:c14. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
3	GND · wire-059	d14	Connect adc:DB0 / CN1 photo label to DIST1:d14. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-060	e14	Connect adc:DB1 / CN1 photo label to DIST1:e14. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-061	c15	Connect adc:DB2 / CN1 photo label to DIST1:c15. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-062	d15	Connect adc:DB3 / CN1 photo label to DIST1:d15. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-063	e15	Connect adc:DB4 / CN1 photo label to DIST1:e15. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-064	c16	Connect adc:DB5 / CN1 photo label to DIST1:c16. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-065	d16	Connect adc:DB6 / CN1 photo label to DIST1:d16. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-066	e16	Connect adc:DB9 / CN1 photo label to DIST1:e16. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-067	c17	Connect adc:DB10 / CN1 photo label to DIST1:c17. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-068	d17	Connect adc:DB11 / CN1 photo label to DIST1:d17. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-069	e17	Connect adc:DB12 / CN1 photo label to DIST1:e17. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-070	c18	Connect adc:DB13 / CN1 photo label to DIST1:c18. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	GND · wire-071	d18	Connect adc:DB14 / CN1 photo label to DIST1:d18. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
6	GND · wire-072	e18	Connect foot:mikroBUS 16 / SNC to DIST1:e18. Complete IMU supply, interface and configuration checks before connecting.
6	GND · wire-073	b19	Connect foot:mikroBUS 9 / GND to DIST1:b19. Complete IMU supply, interface and configuration checks before connecting.
6	GND · wire-074	c19	Connect shank:mikroBUS 16 / SNC to DIST1:c19. Complete IMU supply, interface and configuration checks before connecting.
6	GND · wire-075	d19	Connect shank:mikroBUS 9 / GND to DIST1:d19. Complete IMU supply, interface and configuration checks before connecting.
2	VBAT · wire-076	a20	Connect AUX1:a43 to DIST1:a20. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	VBAT · wire-077	b20	Connect power-switch:SPST solder lug 2 to DIST1:b20. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	VBAT · wire-078	c20	Connect reg5:VIN / 5-pin row 2 to DIST1:c20. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	VBAT · wire-079	d20	Connect reg3:VIN / 5-pin row 2 to DIST1:d20. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	5V · wire-080	a21	Connect reg5:VOUT / 5-pin row 5 to DIST1:a21. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	5V · wire-081	b21	Connect esp:J1.21 / 5V to DIST1:b21. One lead per listed hole/contact. Verify unpowered continuity before applying power.
3	5V · wire-082	c21	Connect adc:+5V / CN1 photo label to DIST1:c21. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
1	3V3D · wire-083	a22	Connect DIST1:a22 to DIST1:a23. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V3D · wire-083	a23	Connect DIST1:a22 to DIST1:a23. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V3D · wire-084	b23	Connect DIST1:b23 to DIST1:a24. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V3D · wire-084	a24	Connect DIST1:b23 to DIST1:a24. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V3D · wire-085	b24	Connect DIST1:b24 to DIST1:a25. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V3D · wire-085	a25	Connect DIST1:b24 to DIST1:a25. One lead per listed hole/contact. Verify unpowered continuity before applying power.
3	3V3D · wire-086	b22	Connect AUX1:a3 to DIST1:b22. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	3V3D · wire-087	c22	Connect AUX1:a7 to DIST1:c22. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	3V3D · wire-088	d22	Connect AUX1:a11 to DIST1:d22. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	3V3D · wire-089	e22	Connect AUX1:a15 to DIST1:e22. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	3V3D · wire-090	c23	Connect AUX2:a7 to DIST1:c23. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V3D · wire-091	d23	Connect reg3:VOUT / 5-pin row 5 to DIST1:d23. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V3D · wire-092	e23	Connect ldo:IN pin1 → JP2.1 to DIST1:e23. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
1	3V3D · wire-093	c24	Connect ldo:EN pin3 → JP2.3 to DIST1:c24. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
3	3V3D · wire-094	d24	Connect adc:VIO / CN1 photo label to DIST1:d24. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
6	3V3D · wire-095	e24	Connect foot:mikroBUS 7 / 3.3V to DIST1:e24. Complete IMU supply, interface and configuration checks before connecting.
6	3V3D · wire-096	b25	Connect shank:mikroBUS 7 / 3.3V to DIST1:b25. Complete IMU supply, interface and configuration checks before connecting.
7	3V3D · wire-097	c25	Connect sd:JP1.1 / 3V3 to DIST1:c25. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V0A · wire-098	a26	Connect DIST1:a26 to DIST1:a27. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V0A · wire-098	a27	Connect DIST1:a26 to DIST1:a27. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V0A · wire-099	b26	Connect BB0:d2 to DIST1:b26. One lead per listed hole/contact. Verify unpowered continuity before applying power.
4	3V0A · wire-100	c26	Connect BB1:h10 to DIST1:c26. One lead per listed hole/contact. Verify unpowered continuity before applying power.
5	3V0A · wire-101	d26	Connect BB2:h10 to DIST1:d26. One lead per listed hole/contact. Verify unpowered continuity before applying power.
1	3V0A · wire-102	e26	Connect ldo:OUT pin5 / 3.0V → JP1.1 to DIST1:e26. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
10	3V0A · wire-103	b27	Connect myo1:VIN solder pad to DIST1:b27. Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
4	3V0A · wire-104	c27	Connect clamp1:CHIP_PAD_2 → JP1.3 to DIST1:c27. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
10	3V0A · wire-105	d27	Connect myo2:VIN solder pad to DIST1:d27. Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
5	3V0A · wire-106	e27	Connect clamp2:CHIP_PAD_2 → JP1.3 to DIST1:e27. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
3	ADC_CS · wire-107	a28	Connect AUX1:g3 to DIST1:a28. One lead per listed hole/contact. Verify unpowered continuity before applying power.
3	ADC_CS · wire-108	b28	Connect esp:J1.16 / GPIO10 to DIST1:b28. One lead per listed hole/contact. Verify unpowered continuity before applying power.
3	ADC_CS · wire-109	c28	Connect adc:CS / CN1 photo label to DIST1:c28. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	ADC_CONVST · wire-114	a29	Connect esp:J1.17 / GPIO11 to DIST1:a29. One lead per listed hole/contact. Verify unpowered continuity before applying power.
3	ADC_CONVST · wire-115	b29	Connect adc:CVA / CN1 photo label to DIST1:b29. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
3	ADC_CONVST · wire-116	c29	Connect adc:CVB / CN1 photo label to DIST1:c29. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
4	AIN0P · wire-117	a30	Connect BB1:c28 to DIST1:a30. One lead per listed hole/contact. Verify unpowered continuity before applying power.
4	AIN0P · wire-118	b30	Connect adc:V1 / CN2 photo label to DIST1:b30. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
10	RAW0 · wire-119	a31	Connect BB1:b2 to DIST1:a31. One lead per listed hole/contact. Verify unpowered continuity before applying power.
10	RAW0 · wire-120	b31	Connect myo1:RAW solder pad to DIST1:b31. Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
4	RC0A · wire-121	a32	Connect BB1:d4 to DIST1:a32. One lead per listed hole/contact. Verify unpowered continuity before applying power.
4	RC0A · wire-122	b32	Connect clamp1:CHIP_PAD_3 → JP2.3 to DIST1:b32. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
5	AIN1P · wire-123	a33	Connect BB2:c28 to DIST1:a33. One lead per listed hole/contact. Verify unpowered continuity before applying power.
5	AIN1P · wire-124	b33	Connect adc:V2 / CN2 photo label to DIST1:b33. Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
10	RAW1 · wire-125	a34	Connect BB2:b2 to DIST1:a34. One lead per listed hole/contact. Verify unpowered continuity before applying power.
10	RAW1 · wire-126	b34	Connect myo2:RAW solder pad to DIST1:b34. Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
5	RC1A · wire-127	a35	Connect BB2:d4 to DIST1:a35. One lead per listed hole/contact. Verify unpowered continuity before applying power.
5	RC1A · wire-128	b35	Connect clamp2:CHIP_PAD_3 → JP2.3 to DIST1:b35. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
6	IMU_MOSI · wire-129	a36	Connect esp:J1.4 / GPIO4 to DIST1:a36. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	IMU_MOSI · wire-130	b36	Connect foot:mikroBUS 6 / MOSI to DIST1:b36. Complete IMU supply, interface and configuration checks before connecting.
6	IMU_MOSI · wire-131	c36	Connect shank:mikroBUS 6 / MOSI to DIST1:c36. Complete IMU supply, interface and configuration checks before connecting.
6	IMU_MISO · wire-132	a37	Connect esp:J1.5 / GPIO5 to DIST1:a37. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	IMU_MISO · wire-133	b37	Connect foot:mikroBUS 5 / MISO to DIST1:b37. Complete IMU supply, interface and configuration checks before connecting.
6	IMU_MISO · wire-134	c37	Connect shank:mikroBUS 5 / MISO to DIST1:c37. Complete IMU supply, interface and configuration checks before connecting.
6	IMU_SCK · wire-135	a38	Connect esp:J1.6 / GPIO6 to DIST1:a38. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	IMU_SCK · wire-136	b38	Connect foot:mikroBUS 4 / SCK to DIST1:b38. Complete IMU supply, interface and configuration checks before connecting.
6	IMU_SCK · wire-137	c38	Connect shank:mikroBUS 4 / SCK to DIST1:c38. Complete IMU supply, interface and configuration checks before connecting.
6	FOOT_CS · wire-138	a39	Connect AUX1:g7 to DIST1:a39. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	FOOT_CS · wire-139	b39	Connect esp:J1.7 / GPIO7 to DIST1:b39. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	FOOT_CS · wire-140	c39	Connect foot:mikroBUS 3 / CS to DIST1:c39. Complete IMU supply, interface and configuration checks before connecting.
6	SHANK_CS · wire-142	a40	Connect AUX1:g11 to DIST1:a40. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	SHANK_CS · wire-143	b40	Connect esp:J1.8 / GPIO15 to DIST1:b40. One lead per listed hole/contact. Verify unpowered continuity before applying power.
6	SHANK_CS · wire-144	c40	Connect shank:mikroBUS 3 / CS to DIST1:c40. Complete IMU supply, interface and configuration checks before connecting.
2	BUTTON · wire-146	a41	Connect AUX1:g15 to DIST1:a41. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BUTTON · wire-147	b41	Connect esp:J1.11 / GPIO18 to DIST1:b41. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BUTTON · wire-148	c41	Connect button:NO contact 1 to DIST1:c41. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_REC · wire-149	a42	Connect AUX1:a19 to DIST1:a42. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_REC · wire-150	b42	Connect esp:J3.7 / GPIO41 to DIST1:b42. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_REC_A · wire-151	a43	Connect AUX1:g19 to DIST1:a43. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_REC_A · wire-152	b43	Connect AUX1:a23 to DIST1:b43. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_ERR · wire-153	a44	Connect AUX1:a27 to DIST1:a44. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_ERR · wire-154	b44	Connect esp:J3.6 / GPIO42 to DIST1:b44. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_ERR_A · wire-155	a45	Connect AUX1:g27 to DIST1:a45. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_ERR_A · wire-156	b45	Connect AUX1:a31 to DIST1:b45. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_LOW · wire-157	a46	Connect AUX1:a35 to DIST1:a46. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_LOW · wire-158	b46	Connect esp:J3.5 / GPIO2 to DIST1:b46. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_LOW_A · wire-159	a47	Connect AUX1:g35 to DIST1:a47. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	LED_LOW_A · wire-160	b47	Connect AUX1:a39 to DIST1:b47. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BAT_SENSE · wire-161	a48	Connect AUX1:g43 to DIST1:a48. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BAT_SENSE · wire-162	b48	Connect AUX1:a47 to DIST1:b48. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BAT_SENSE · wire-163	c48	Connect AUX1:a51 to DIST1:c48. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	BAT_SENSE · wire-164	d48	Connect esp:J3.4 / GPIO1 to DIST1:d48. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	USB_VBUS · wire-165	a49	Connect AUX1:a55 to DIST1:a49. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	USB_VBUS · wire-166	b49	Connect usb:JP2.5 / VBUS to DIST1:b49. External USB inlet only; both DevKit USB sockets empty. VBUS is sense-only, never connected to recorder 5 V.
2	USB_GATE · wire-167	a50	Connect AUX1:g55 to DIST1:a50. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	USB_GATE · wire-168	b50	Connect AUX2:a3 to DIST1:b50. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	USB_GATE · wire-169	c50	Connect usb-q:GATE pin1 → JP1.2 to DIST1:c50. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
2	USB_PRESENT_N · wire-170	a51	Connect AUX2:g7 to DIST1:a51. One lead per listed hole/contact. Verify unpowered continuity before applying power.
2	USB_PRESENT_N · wire-171	b51	Connect usb-q:DRAIN pin3 → JP2.3 to DIST1:b51. Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
2	USB_PRESENT_N · wire-172	c51	Connect esp:J3.18 / GPIO21 to DIST1:c51. One lead per listed hole/contact. Verify unpowered continuity before applying power.
7	GND · wire-184	e19	Connect DIST1:e19 to sd JP1.2 / GND. microSD return lead; verified JP1 pad 2 belongs to GND in Adafruit SDIO microSD board CAD. Install with power off.

External wires

Wire	Stage	Net	From	To	Instruction
wire-001	9	SOURCE_POS	battery:JST-PH red + lead	DIST1:a1	Connect lab source OR battery, never both; remove both lab leads before battery attachment.
wire-002	1	SOURCE_POS	power-switch:SPST solder lug 1	DIST1:b1	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-003	1	SOURCE_POS	lab-supply:Red + binding post	DIST1:c1	Connect lab source OR battery, never both; remove both lab leads before battery attachment.
wire-004	1	GND	DIST1:a2	DIST1:a3	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-005	1	GND	DIST1:b3	DIST1:a4	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-006	1	GND	DIST1:b4	DIST1:a5	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-007	1	GND	DIST1:b5	DIST1:a6	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-008	1	GND	DIST1:b6	DIST1:a7	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-009	1	GND	DIST1:b7	DIST1:a8	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-010	1	GND	DIST1:b8	DIST1:a9	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-011	1	GND	DIST1:b9	DIST1:a10	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-012	1	GND	DIST1:b10	DIST1:a11	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-013	1	GND	DIST1:b11	DIST1:a12	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-014	1	GND	DIST1:b12	DIST1:a13	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-015	1	GND	DIST1:b13	DIST1:a14	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-016	1	GND	DIST1:b14	DIST1:a15	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-017	1	GND	DIST1:b15	DIST1:a16	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-018	1	GND	DIST1:b16	DIST1:a17	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-019	1	GND	DIST1:b17	DIST1:a18	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-020	1	GND	DIST1:b18	DIST1:a19	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-021	1	GND	BB0:e6	DIST1:b2	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-022	4	GND	BB1:d6	DIST1:c2	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-023	5	GND	BB2:d6	DIST1:d2	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-024	2	GND	AUX1:g23	DIST1:e2	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-025	2	GND	AUX1:g31	DIST1:c3	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-026	2	GND	AUX1:g39	DIST1:d3	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-027	2	GND	AUX1:g47	DIST1:e3	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-028	2	GND	AUX1:g51	DIST1:c4	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-029	2	GND	AUX2:g3	DIST1:d4	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-030	1	GND	lab-supply:Black COM binding post	DIST1:e4	Connect lab source OR battery, never both; remove both lab leads before battery attachment.
wire-031	1	GND	reg3:GND / 5-pin row 3	DIST1:c5	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-032	1	GND	reg5:GND / 5-pin row 3	DIST1:d5	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-033	9	GND	battery:JST-PH black − lead	DIST1:e5	Connect lab source OR battery, never both; remove both lab leads before battery attachment.
wire-034	2	GND	esp:J1.22 / GND	DIST1:c6	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-035	1	GND	ldo:GND pin2 → JP2.2	DIST1:d6	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-036	3	GND	adc:GND / CN1 photo label	DIST1:e6	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-037	3	GND	adc:OS0 / CN1 photo label	DIST1:c7	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-038	3	GND	adc:OS1 / CN1 photo label	DIST1:d7	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-039	3	GND	adc:OS2 / CN1 photo label	DIST1:e7	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-040	3	GND	adc:RAGE / CN1 photo label	DIST1:c8	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-041	3	GND	adc:DB15 / CN1 photo label	DIST1:d8	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-042	3	GND	adc:V3 unused input / CN2 photo label	DIST1:e8	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-043	3	GND	adc:V4 unused input / CN2 photo label	DIST1:c9	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-044	3	GND	adc:V5 unused input / CN2 photo label	DIST1:d9	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-045	3	GND	adc:V6 unused input / CN2 photo label	DIST1:e9	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-046	3	GND	adc:V7 unused input / CN2 photo label	DIST1:c10	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-047	3	GND	adc:V8 unused input / CN2 photo label	DIST1:d10	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-048	3	GND	adc:G beside V1 / CN2 photo label	DIST1:e10	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-049	10	GND	myo1:GND solder pad	DIST1:c11	Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
wire-050	4	GND	clamp1:CHIP_PAD_1 → JP1.2	DIST1:d11	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-051	3	GND	adc:G beside V2 / CN2 photo label	DIST1:e11	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-052	10	GND	myo2:GND solder pad	DIST1:c12	Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
wire-053	5	GND	clamp2:CHIP_PAD_1 → JP1.2	DIST1:d12	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-054	6	GND	foot:mikroBUS 8 / GND	DIST1:e12	Complete IMU supply, interface and configuration checks before connecting.
wire-055	6	GND	shank:mikroBUS 8 / GND	DIST1:c13	Complete IMU supply, interface and configuration checks before connecting.
wire-056	2	GND	button:NO contact 2	DIST1:d13	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-057	2	GND	usb:JP2.1 / GND	DIST1:e13	External USB inlet only; both DevKit USB sockets empty. VBUS is sense-only, never connected to recorder 5 V.
wire-058	2	GND	usb-q:SOURCE pin2 → JP1.3	DIST1:c14	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-059	3	GND	adc:DB0 / CN1 photo label	DIST1:d14	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-060	3	GND	adc:DB1 / CN1 photo label	DIST1:e14	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-061	3	GND	adc:DB2 / CN1 photo label	DIST1:c15	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-062	3	GND	adc:DB3 / CN1 photo label	DIST1:d15	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-063	3	GND	adc:DB4 / CN1 photo label	DIST1:e15	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-064	3	GND	adc:DB5 / CN1 photo label	DIST1:c16	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-065	3	GND	adc:DB6 / CN1 photo label	DIST1:d16	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-066	3	GND	adc:DB9 / CN1 photo label	DIST1:e16	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-067	3	GND	adc:DB10 / CN1 photo label	DIST1:c17	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-068	3	GND	adc:DB11 / CN1 photo label	DIST1:d17	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-069	3	GND	adc:DB12 / CN1 photo label	DIST1:e17	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-070	3	GND	adc:DB13 / CN1 photo label	DIST1:c18	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-071	3	GND	adc:DB14 / CN1 photo label	DIST1:d18	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-072	6	GND	foot:mikroBUS 16 / SNC	DIST1:e18	Complete IMU supply, interface and configuration checks before connecting.
wire-073	6	GND	foot:mikroBUS 9 / GND	DIST1:b19	Complete IMU supply, interface and configuration checks before connecting.
wire-074	6	GND	shank:mikroBUS 16 / SNC	DIST1:c19	Complete IMU supply, interface and configuration checks before connecting.
wire-075	6	GND	shank:mikroBUS 9 / GND	DIST1:d19	Complete IMU supply, interface and configuration checks before connecting.
wire-076	2	VBAT	AUX1:a43	DIST1:a20	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-077	1	VBAT	power-switch:SPST solder lug 2	DIST1:b20	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-078	1	VBAT	reg5:VIN / 5-pin row 2	DIST1:c20	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-079	1	VBAT	reg3:VIN / 5-pin row 2	DIST1:d20	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-080	2	5V	reg5:VOUT / 5-pin row 5	DIST1:a21	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-081	2	5V	esp:J1.21 / 5V	DIST1:b21	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-082	3	5V	adc:+5V / CN1 photo label	DIST1:c21	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-083	1	3V3D	DIST1:a22	DIST1:a23	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-084	1	3V3D	DIST1:b23	DIST1:a24	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-085	1	3V3D	DIST1:b24	DIST1:a25	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-086	3	3V3D	AUX1:a3	DIST1:b22	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-087	6	3V3D	AUX1:a7	DIST1:c22	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-088	6	3V3D	AUX1:a11	DIST1:d22	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-089	2	3V3D	AUX1:a15	DIST1:e22	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-090	2	3V3D	AUX2:a7	DIST1:c23	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-091	1	3V3D	reg3:VOUT / 5-pin row 5	DIST1:d23	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-092	1	3V3D	ldo:IN pin1 → JP2.1	DIST1:e23	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-093	1	3V3D	ldo:EN pin3 → JP2.3	DIST1:c24	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-094	3	3V3D	adc:VIO / CN1 photo label	DIST1:d24	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-095	6	3V3D	foot:mikroBUS 7 / 3.3V	DIST1:e24	Complete IMU supply, interface and configuration checks before connecting.
wire-096	6	3V3D	shank:mikroBUS 7 / 3.3V	DIST1:b25	Complete IMU supply, interface and configuration checks before connecting.
wire-097	7	3V3D	sd:JP1.1 / 3V3	DIST1:c25	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-098	1	3V0A	DIST1:a26	DIST1:a27	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-099	1	3V0A	BB0:d2	DIST1:b26	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-100	4	3V0A	BB1:h10	DIST1:c26	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-101	5	3V0A	BB2:h10	DIST1:d26	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-102	1	3V0A	ldo:OUT pin5 / 3.0V → JP1.1	DIST1:e26	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-103	10	3V0A	myo1:VIN solder pad	DIST1:b27	Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
wire-104	4	3V0A	clamp1:CHIP_PAD_2 → JP1.3	DIST1:c27	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-105	10	3V0A	myo2:VIN solder pad	DIST1:d27	Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
wire-106	5	3V0A	clamp2:CHIP_PAD_2 → JP1.3	DIST1:e27	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-107	3	ADC_CS	AUX1:g3	DIST1:a28	After module qualification, verify active-low CS on GPIO10. A measured frame contains all 128 clocks; RESET-time discarded reads are separate. Keep SPI leads short with nearby ground return.
wire-108	3	ADC_CS	esp:J1.16 / GPIO10	DIST1:b28	After module qualification, verify active-low CS on GPIO10. A measured frame contains all 128 clocks; RESET-time discarded reads are separate. Keep SPI leads short with nearby ground return.
wire-109	3	ADC_CS	adc:CS / CN1 photo label	DIST1:c28	After module qualification, verify active-low CS on GPIO10. A measured frame contains all 128 clocks; RESET-time discarded reads are separate. Keep SPI leads short with nearby ground return.
wire-110	3	ADC_SCK	esp:J1.18 / GPIO12	adc:RD / CN1 photo label	RD is serial SCLK: GPIO12, 8 MHz, SPI mode 2 (idle HIGH; sample falling edge). Measure physical idle/setup/hold; the Wokwi idle-level limitation does not authorize a polarity change.
wire-111	3	ADC_MISO	esp:J1.19 / GPIO13	adc:DB7 / CN1 photo label	DB7 is DOUTA in verified serial mode: GPIO13 receives all eight 16-bit words in V1–V8 order. Export only EMG1/2. DB8/DOUTB is unused, not a second MISO lead.
wire-112	3	ADC_RESET	esp:J1.15 / GPIO9	adc:RST / CN1 photo label	RST is active HIGH on GPIO9. Firmware discards one RESET-time read per ADC configuration; normally one at diagnostic boot, two before the first recording session. Do not count these as EMG conversions.
wire-113	3	ADC_DRDY	esp:J1.12 / GPIO8	adc:BUSY / CN1 photo label	This shared net name means AD7606 BUSY on GPIO8. Verify BUSY asserts after CONVST and falls before SCLK; a missing/stuck/late BUSY must produce a fault, not stale plausible data.
wire-114	3	ADC_CONVST	esp:J1.17 / GPIO11	DIST1:a29	GPIO11 must reach BOTH CVA and CVB through the same DIST1 a29/b29/c29 five-hole strip. Verify unpowered continuity and simultaneous rising edges. Never leave one conversion group floating.
wire-115	3	ADC_CONVST	adc:CVA / CN1 photo label	DIST1:b29	GPIO11 must reach BOTH CVA and CVB through the same DIST1 a29/b29/c29 five-hole strip. Verify unpowered continuity and simultaneous rising edges. Never leave one conversion group floating.
wire-116	3	ADC_CONVST	adc:CVB / CN1 photo label	DIST1:c29	GPIO11 must reach BOTH CVA and CVB through the same DIST1 a29/b29/c29 five-hole strip. Verify unpowered continuity and simultaneous rising edges. Never leave one conversion group floating.
wire-117	4	AIN0P	BB1:c28	DIST1:a30	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-118	4	AIN0P	adc:V1 / CN2 photo label	DIST1:b30	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-119	10	RAW0	BB1:b2	DIST1:a31	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-120	10	RAW0	myo1:RAW solder pad	DIST1:b31	Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
wire-121	4	RC0A	BB1:d4	DIST1:a32	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-122	4	RC0A	clamp1:CHIP_PAD_3 → JP2.3	DIST1:b32	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-123	5	AIN1P	BB2:c28	DIST1:a33	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-124	5	AIN1P	adc:V2 / CN2 photo label	DIST1:b33	Complete ADC module qualification before connecting. Use connector labels and orientation, not the model dimensions.
wire-125	10	RAW1	BB2:b2	DIST1:a34	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-126	10	RAW1	myo2:RAW solder pad	DIST1:b34	Use bare-sensor RAW, VIN and GND pads; no person attached during instrument tests.
wire-127	5	RC1A	BB2:d4	DIST1:a35	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-128	5	RC1A	clamp2:CHIP_PAD_3 → JP2.3	DIST1:b35	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-129	6	IMU_MOSI	esp:J1.4 / GPIO4	DIST1:a36	Shared ICM SPI MOSI is GPIO4 to both mikroBUS pin 6 contacts. Use SPI JP2–JP4 positions 1–2; qualify 3.3 V and carrier orientation before wiring.
wire-130	6	IMU_MOSI	foot:mikroBUS 6 / MOSI	DIST1:b36	Shared ICM SPI MOSI is GPIO4 to both mikroBUS pin 6 contacts. Use SPI JP2–JP4 positions 1–2; qualify 3.3 V and carrier orientation before wiring.
wire-131	6	IMU_MOSI	shank:mikroBUS 6 / MOSI	DIST1:c36	Shared ICM SPI MOSI is GPIO4 to both mikroBUS pin 6 contacts. Use SPI JP2–JP4 positions 1–2; qualify 3.3 V and carrier orientation before wiring.
wire-132	6	IMU_MISO	esp:J1.5 / GPIO5	DIST1:a37	Shared ICM SPI MISO is GPIO5 from both mikroBUS pin 5 contacts. Separate CS lines select each carrier; verify the inactive carrier releases the bus.
wire-133	6	IMU_MISO	foot:mikroBUS 5 / MISO	DIST1:b37	Shared ICM SPI MISO is GPIO5 from both mikroBUS pin 5 contacts. Separate CS lines select each carrier; verify the inactive carrier releases the bus.
wire-134	6	IMU_MISO	shank:mikroBUS 5 / MISO	DIST1:c37	Shared ICM SPI MISO is GPIO5 from both mikroBUS pin 5 contacts. Separate CS lines select each carrier; verify the inactive carrier releases the bus.
wire-135	6	IMU_SCK	esp:J1.6 / GPIO6	DIST1:a38	Shared ICM SPI SCLK is GPIO6 to both mikroBUS pin 4 contacts; 1 MHz mode 0 in this firmware. Keep leads short with a nearby ground return.
wire-136	6	IMU_SCK	foot:mikroBUS 4 / SCK	DIST1:b38	Shared ICM SPI SCLK is GPIO6 to both mikroBUS pin 4 contacts; 1 MHz mode 0 in this firmware. Keep leads short with a nearby ground return.
wire-137	6	IMU_SCK	shank:mikroBUS 4 / SCK	DIST1:c38	Shared ICM SPI SCLK is GPIO6 to both mikroBUS pin 4 contacts; 1 MHz mode 0 in this firmware. Keep leads short with a nearby ground return.
wire-138	6	FOOT_CS	AUX1:g7	DIST1:a39	Foot ICM chip select is GPIO7 to mikroBUS pin 3 / CS. Rotate only the foot carrier and confirm the foot stream identity before adding the shank.
wire-139	6	FOOT_CS	esp:J1.7 / GPIO7	DIST1:b39	Foot ICM chip select is GPIO7 to mikroBUS pin 3 / CS. Rotate only the foot carrier and confirm the foot stream identity before adding the shank.
wire-140	6	FOOT_CS	foot:mikroBUS 3 / CS	DIST1:c39	Foot ICM chip select is GPIO7 to mikroBUS pin 3 / CS. Rotate only the foot carrier and confirm the foot stream identity before adding the shank.
wire-141	6	FOOT_INT	esp:J1.9 / GPIO16	foot:mikroBUS 15 / INT	Foot INT1 uses mikroBUS pin 15 / INT to GPIO16. Verify active-high pulses at 200 Hz independently of shank; missing IRQ or FIFO overflow must remain visible.
wire-142	6	SHANK_CS	AUX1:g11	DIST1:a40	Shank ICM chip select is GPIO15 to mikroBUS pin 3 / CS. Rotate only the shank carrier and confirm the shank stream identity.
wire-143	6	SHANK_CS	esp:J1.8 / GPIO15	DIST1:b40	Shank ICM chip select is GPIO15 to mikroBUS pin 3 / CS. Rotate only the shank carrier and confirm the shank stream identity.
wire-144	6	SHANK_CS	shank:mikroBUS 3 / CS	DIST1:c40	Shank ICM chip select is GPIO15 to mikroBUS pin 3 / CS. Rotate only the shank carrier and confirm the shank stream identity.
wire-145	6	SHANK_INT	esp:J1.10 / GPIO17	shank:mikroBUS 15 / INT	Shank INT1 uses mikroBUS pin 15 / INT to GPIO17. Verify active-high pulses at 200 Hz independently of foot; preserve independent startup times and counters.
wire-146	2	BUTTON	AUX1:g15	DIST1:a41	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-147	2	BUTTON	esp:J1.11 / GPIO18	DIST1:b41	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-148	2	BUTTON	button:NO contact 1	DIST1:c41	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-149	2	LED_REC	AUX1:a19	DIST1:a42	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-150	2	LED_REC	esp:J3.7 / GPIO41	DIST1:b42	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-151	2	LED_REC_A	AUX1:g19	DIST1:a43	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-152	2	LED_REC_A	AUX1:a23	DIST1:b43	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-153	2	LED_ERR	AUX1:a27	DIST1:a44	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-154	2	LED_ERR	esp:J3.6 / GPIO42	DIST1:b44	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-155	2	LED_ERR_A	AUX1:g27	DIST1:a45	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-156	2	LED_ERR_A	AUX1:a31	DIST1:b45	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-157	2	LED_LOW	AUX1:a35	DIST1:a46	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-158	2	LED_LOW	esp:J3.5 / GPIO2	DIST1:b46	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-159	2	LED_LOW_A	AUX1:g35	DIST1:a47	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-160	2	LED_LOW_A	AUX1:a39	DIST1:b47	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-161	2	BAT_SENSE	AUX1:g43	DIST1:a48	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-162	2	BAT_SENSE	AUX1:a47	DIST1:b48	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-163	2	BAT_SENSE	AUX1:a51	DIST1:c48	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-164	2	BAT_SENSE	esp:J3.4 / GPIO1	DIST1:d48	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-165	2	USB_VBUS	AUX1:a55	DIST1:a49	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-166	2	USB_VBUS	usb:JP2.5 / VBUS	DIST1:b49	External USB inlet only; both DevKit USB sockets empty. VBUS is sense-only, never connected to recorder 5 V.
wire-167	2	USB_GATE	AUX1:g55	DIST1:a50	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-168	2	USB_GATE	AUX2:a3	DIST1:b50	One lead per listed hole/contact. Verify unpowered continuity before applying power.
wire-169	2	USB_GATE	usb-q:GATE pin1 → JP1.2	DIST1:c50	Use the specified adapter pad-to-header mapping; check solder orientation and unpowered continuity.
wire-170	2	USB_PRESENT_N	AUX2:g7	DIST1:a51	GPIO21 is LOW when external USB is attached and HIGH when absent; the diagnostic attachment indicator prints the inverse. USB VBUS is sense-only; leave both DevKit USB sockets empty.
wire-171	2	USB_PRESENT_N	usb-q:DRAIN pin3 → JP2.3	DIST1:b51	GPIO21 is LOW when external USB is attached and HIGH when absent; the diagnostic attachment indicator prints the inverse. USB VBUS is sense-only; leave both DevKit USB sockets empty.
wire-172	2	USB_PRESENT_N	esp:J3.18 / GPIO21	DIST1:c51	GPIO21 is LOW when external USB is attached and HIGH when absent; the diagnostic attachment indicator prints the inverse. USB VBUS is sense-only; leave both DevKit USB sockets empty.
wire-173	2	USB_DM	usb:JP2.4 / D-	usb-dm-r:lead 1	External USB inlet only; both DevKit USB sockets empty. VBUS is sense-only, never connected to recorder 5 V.
wire-174	2	USB_DM_MCU	usb-dm-r:lead 2	esp:J3.20 / GPIO19	External USB inlet only; both DevKit USB sockets empty. VBUS is sense-only, never connected to recorder 5 V.
wire-175	2	USB_DP	usb:JP2.3 / D+	usb-dp-r:lead 1	External USB inlet only; both DevKit USB sockets empty. VBUS is sense-only, never connected to recorder 5 V.
wire-176	2	USB_DP_MCU	usb-dp-r:lead 2	esp:J3.19 / GPIO20	External USB inlet only; both DevKit USB sockets empty. VBUS is sense-only, never connected to recorder 5 V.
wire-177	7	SD_CMD	esp:J3.17 / GPIO47	sd:JP1.5	SDMMC CMD is GPIO47 on the breadboard and Adafruit 4682 JP1.5. Select breadboard-sd-only-2ch or breadboard-record-2ch; the PCB image uses GPIO38.
wire-178	7	SD_CLK	esp:J3.9 / GPIO39	sd:JP1.3	SDMMC CLK is GPIO39 to Adafruit 4682 JP1.3. This is not SPI SD wiring. Keep the card supply stable and audit the original saved file.
wire-179	7	SD_D0	esp:J3.8 / GPIO40	sd:JP1.4	SDMMC D0 is GPIO40 to Adafruit 4682 JP1.4. Use all five listed SD contacts, including GND. A wireless preview cannot establish SD persistence.
wire-180	1	3V3D	cap-2:lead 1	ldo:U$1.1 solder pad	Local soldered LDO bypass, short insulated leads; not a remote breadboard capacitor.
wire-181	1	GND	cap-2:lead 2	ldo:U$1.2 solder pad	Local soldered LDO bypass, short insulated leads; not a remote breadboard capacitor.
wire-182	1	3V0A	cap-3:lead 1	ldo:U$1.6 solder pad	Local soldered LDO bypass, short insulated leads; not a remote breadboard capacitor.
wire-183	1	GND	cap-3:lead 2	ldo:U$1.2 solder pad	Local soldered LDO bypass, short insulated leads; not a remote breadboard capacitor.
wire-184	7	GND	sd:JP1.2 / GND	DIST1:e19	microSD return lead; verified JP1 pad 2 belongs to GND in Adafruit SDIO microSD board CAD. Install with power off.